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PCB Manufacturing Services
Turning your designs into high-performance, production-ready circuit boards.
We take your Gerber files and transform them into fully functional PCBs with precision and reliability. From schematic to finished product, we ensure every detail meets industry standards.
Multilayer lamination
Precision drilling & hole plating
Electrical patterning
High-quality surface finishing
Manufacturing Capabilities
Built for precision, speed, and reliability
Large format PCB’s
3/3mil technology
Rigid, Rigid Flex, and FLex PCB’s
Copper coin technology
Rogers RF substrates
High-Speed PCB substrates
Laser microvias, blind vias, buried vias
Bare board electrical testing
PCB Impedance testing
Class 2 & 3 quality
RoHS Surface finishes
Fast turnaround times
Quality Standards
Quality Standards
ANSI/ESD S20.20 2014
AS9100:2004 and ISO9001:2008
ISO 13485
MIL-P-55110
MIL-PRF-31032
MIL-STD-45662
IPC-600-A
IPC-610-D
J-STD-001
IPC-CID
Substrates
Substrates
FR-4, High Temp
Rogers 3000 Series
Rogers 4000 Series
Rogers 5000 Series
Teflon
Arlon
Taconic
Polyamide
Aluminum
TMM
Nelco
Kappa 438
Company Attributes
Company Attributes
Turnkey electronic engineering solutions that cover your project from concept to production
Military, aerospace, medical, automotive and commercial applications
Highly knowledgeable team of electronic engineers and PCB designers
Experts in RF PCB Design, high speed digital PCB design and microwave electronic design
Member of IPC designer’s council with PCB design certification
Solid PCB manufacturing knowledge for superior designs
Great communication with customers and comprehensive online design reviews
Exceptional turnaround time on projects to help meet customer deadlines
Complete confidentiality of your projects and IP
Competitive prices on of our all services
Worldwide customer base
Standard Capabilities
Standard Capabilities
This is a list of our standard capabilities not our maximum capabilities. If your design needs anything outside of these specifications, please call or email us.
Materials and process per military and IPC spec. UL approved.
Materials
FR-4
370HR
FR406
FR408
Nelco Buried Capacitance
Polyimide
Teflon
Rogers
Taconic
Arlon
Hybrid FR-4 / Rogers
Layer Count 1 to 50 Layers
Minimum line spacing 0.003″
Material Thickness 0.002″ to 0.300″
Minimum Annular Ring 0.005″
Minimum drilled hole size 0.008″
Maximum board size 35″ x 46″
Maximum Copper Thickness 5oz.
Solder Mask SMOBC, LPI or Dry Film
Finish Plating HASL
Lead Free HASL
Immersion Silver
ENIG
ENEPIG
Matte Tin Plate
Soft / Hard Gold for Tabs and SMT
Selective Gold
Palladium
Silkscreen Colors White
Yellow
Black
Solder Mask Colors Green
Blue
Red
Black
Clear
Panelization Routing
V-Groove
Other Services Laser Vias
Tented Vias
Plated Slots
Edge Plating
Controlled Dielectrics
Conductive Filled Vias
Blind/Buried Vias
ITAR
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